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t ~IU'
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Wire Wmpping
construction it is possible to eliminate the "breadboard" stage of
development and pass straight from theoretical circuit diagram to a
wire-wrapped model which can be used for laboratory tests and service
assessment prior to embarking on the printed-circuit board design. This
approach not only saves time but provides a more representative
assessment of the equipment's performance.
The cold-cure resin coating
technique was used to solve a number
of difficult manufacturing problems
during the year. These resins are
characterised by their capacity to
reproduce
intricate
shapes
when
poured into a suitable mould or to
actually make the mould itself by
pouring the resin over a sample
component treated with a release
agent.
The technique lends
itself
to prototype and small batch
production.
Printed Circuit Boards
There was a one-third increase in
the number of printed circuit boards
made during 1977, over 3,200 which
includes 800 made by outside
contractors. More significant was
the huge increase in
through-hole-plated boards, some
four times the 1976 total. Most of
these had gold plated edge
connectors.
.
...
Re8in Ca8ting
- 41 -
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